JPH061389Y2 - スラッシュ成形用金型構造 - Google Patents
スラッシュ成形用金型構造Info
- Publication number
- JPH061389Y2 JPH061389Y2 JP9771589U JP9771589U JPH061389Y2 JP H061389 Y2 JPH061389 Y2 JP H061389Y2 JP 9771589 U JP9771589 U JP 9771589U JP 9771589 U JP9771589 U JP 9771589U JP H061389 Y2 JPH061389 Y2 JP H061389Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- raw material
- molding
- molding part
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 title claims description 75
- 239000002994 raw material Substances 0.000 claims description 39
- 238000007789 sealing Methods 0.000 claims description 20
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 10
- 238000005338 heat storage Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9771589U JPH061389Y2 (ja) | 1989-08-22 | 1989-08-22 | スラッシュ成形用金型構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9771589U JPH061389Y2 (ja) | 1989-08-22 | 1989-08-22 | スラッシュ成形用金型構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0336816U JPH0336816U (en]) | 1991-04-10 |
JPH061389Y2 true JPH061389Y2 (ja) | 1994-01-12 |
Family
ID=31646848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9771589U Expired - Lifetime JPH061389Y2 (ja) | 1989-08-22 | 1989-08-22 | スラッシュ成形用金型構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH061389Y2 (en]) |
-
1989
- 1989-08-22 JP JP9771589U patent/JPH061389Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0336816U (en]) | 1991-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |